Guna Selvaduray

• 2008

  • Aihara, H., Selvaduray, G., Craig, A. Y., Moskito, J., "Surface Characteristics and Biocompatibility Study of Electropolished Wrought Co-Cr Alloy L605 for Biomedical Application," Proceedings of the 2008 International Medical Devices Conference, Minneapolis, MN, (October 1-3, 2008).

    Aihara, H., Selvaduray, G., "Surface Characterization and Biocompatibility of Co-Cr Alloy L605 Electropolished in 15 vol % Phosphoric Acid," Proceedings of the 2008 Translational Biomaterial Research Symposium, Atlanta, Georgia, (September 11-13, 2008).

    Leung, D., Selvaduray, G., "Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates," Journal of Microelectronics and Electronic Packaging, 5, 104-115 (2008).

    Aihara, H., G. S. Selvaduray, A. Y. Craig, and J. Moskito, “Surface Characteristics and Biocompatibility Study of Electropolished Wrought Co-Cr Alloy L605 for Biomedical Application”, Proceedings of 2008 International Medical Devices Conference, Oct 1-3, 2008, Minneapolis, Minnesota

    Leung, D. and G. Selvaduray, “Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates,” Journal of Microelectronics and Electronic Packaging, No. 5, p 104-115.

    Aihara, H. and G. S. Selvaduray, “Surface Characterization and Biocompatibility of Co-Cr Alloy L605 Electropolished in 15 vol % Phosphoric Acid”, Proceedings of 2008 Translational Biomaterial Research Symposium, Society for Biomaterials, September 11-13, 2008, Atlanta, Georgia

• 2007

  • M. Drexel*, G. Selvaduray, and A. Pelton, "The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire," 2nd Frontiers in Biomedical Devices Conference, Irvine, California (June 7-8, 2007)

    Drexel, M.*, G.S. Selvaduray, and A. Pelton, "The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire," Proceedings of Materials and Processes for Medical Devices Conference, Palm Desert, California (September 23-25, 2007)

    Cruz, M. M.*, Winslow, R. T., Selvaduray, G. S., "Effect of BGA Reballing on the Formation of Intermetallic Compounds," Proceedings of the Symposium for RoHS Impact on Rework/Repair/Reprocessing, College Park, MD, (September 11, 2007).

    Cruz, M. M.*, Winslow, R. T., Selvaduray, G. S., "Minimizing Thermal Gradients during Hot Solder Dip," Proceedings of the Components for Military & Space Electronics Conference, Los Angeles, CA, (March 12-15, 2007). 335-352.

    Cruz, M. M.*, Selvaduray, G. S., "Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Printed Circuit Board Coatings," Proceedings of the IPC International Conference on Lead-free Materials Surface Finishes, San Jose, CA, (May 8-9, 2007).

    Chun, B., Aihara, H., Kuo, A. M-C.*, Jaladi, K., Selvaduray, G., Craig, A. Y., "Effect of Microblasting on Surface Characteristics and Cytotoxicity of NiTi," Proceedings of the Materials and Processes for Medical Devices Conference, Palm Desert, (September 23-25, 2007).

    Drexel, M., G.S. Selvaduray, and A. Pelton, “The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire", Proceedings of Materials and Processes for Medical Devices Conference, Palm Desert, California (September 23-25, 2007).

    Chun B., H, Aihara, A.M.-C. Kuo, K.Jaladi, G. S. Selvaduray, and A.Y. Craig, “Effect of Microblasting on Surface Characteristics and Cytotoxicity of NiTi”, Proceedings of Materials and Processes for Medical Devices Conference, Palm Desert, California (September 23-25, 2007).

    Cruz, M. M., R. T. Winslow, and G.Selvaduray, “Effect of BGA Reballing on the Formation of Intermetallic Compounds,” Symposium for RoHS Impact on Rework/Repair/ Reprocessing, Maryland, USA (September 11, 2007).

• 2006

  • Drexel, M. J.*, Selvaduray, G., Pelton A. , "The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire," Proceedings of the 4th International Conference on Shape Memory and Superelastic Technologies, Pacific Grove, CA, (May 7-11, 2006).

    Selvaduray, G. S., Trigwell, S., "Effect of Surface Treatment on Surface Characteristics and Biocompatibility of AISI 316L Stainless Steel," Proceedings of the NanoBio2006 Frontiers in Biomedical Devices Conference, Irvine, CA, (June 8-9, 2006).

    Vukazich, S., Selvaduray, G., Tran, J., "Santa Clara County Soft First Story Multi Unit Building Survey," Earthquake Spectra, (November 2006).

    Winslow, R. T., Iyer, G. R., Cruz, M. M.*, Selvaduray, G. S., "Hot Solder Dip and Minimizing Thermal Gradients," Proceedings of the International Microelectronics and Packaging Society International Symposium, San Diego, CA, (October 8-12, 2006). 513-520.

    Vukazich, S., G. Selvaduray and J. Tran, "Santa Clara County Soft FirstStory Multi Unit Building Survey", Earthquake Spectra, November 2006.

    Vukazich, S., G. Selvaduray, and J. Tran, “Santa Clara County Soft First Story Multi Unit Building Survey”, Earthquake Spectra, Earthquake Engineering Research Institute, (November 2006).

    Selvaduray, G. and S. Trigwell, “Effect of Surface Treatment on Surface Characteristics and Biocompatibility of AISI 316L Stainless Steel,” Proceedings of NanoBio2006 Frontiers in Biomedical Devices Conference, Irvine, California. (June 8-9, 2006).

    Drexel, Masao J., G. Selvaduray and A. Pelton, “The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire”, Proc. 4th International Conference on Shape Memory and Superelastic Technologies, Asilomar, California. (April 2006).

• 2005

  • Selvaduray, G. and S. Trigwell, "Effect of Surface Treatment on Surface Characteristics of 316L Stainless Steel" Proceedings Materials and Processes for Medical Devices Conference, ASM International, Boston, Massachusetts. (November 14-16, 2005)

    Selvaduray, G., "Partnership Building for Disaster Mitigation: Collaboration among Government, Business and Academia", Proceedings International Workshop on Emergency Response and Rescue, National Council on Science and Technology for Disaster Reduction, Taipei, Taiwan. (October 31-November 1, 2005)

    Trigwell, S. and G. Selvaduray, "Effects of welding on the passive oxide film of electropolished 316L stainless steel," Journal of Materials Processing Technology No. 166 p 30-43 (2005).

    Chang, W.*, D.-S Jiang and G. Selvaduray, "CSP Drop Test Performance Comparison for Different Solder Ball Materials", Proceedings IPC/JEDEC 8th International Conference on Lead Free Electronic Components and Assemblies, San Jose, California. (April 2005)

• 2004

  • Trigwell, S.* and G. Selvaduray (MatE), "Effects of welding on the passive oxide film of electropolished 316L stainless steel," Journal of Materials Processing Technology (Accepted for publication) June 2004.

• 2003

  • Fariabi, S., M. Rooein and G. Selvaduray (MatE), "Structure-Property-Processing Relationships of 316L Stainless Steel Hypotubing for Manufacturing of Intravascular Stents", Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

    Selvaduray, G. (MatE), and H. Bueno*, "The Critical Surface Tension of 316L Stainless Steel: Implications for Stent Thrombogenicity", Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

    Selvaduray, G., and H. Bueno, "The Critical Surface Tension of 316L Stainless Steel: Implications for Stent Thrombogenicity", Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

    Fariabi, S., M. Rooein and G. Selvaduray, "Structure-Property-Processing Relationships of 316L Stainless Steel Hypotubing for Manufacturing of Intravascular Stents", Proceedings Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.

• 2002

  • Selvaduray, G ., K. McMullin, S. Arnold and R. Brindos*, "Nonstructural Hazard Mitigation Retrofit of an Engineering Laboratory at San Jose State University," Submitted for presentation at the Seventh National Conference on Earthquake Engineering, Boston, Massachusetts, July 2002.

• 2001

  • Selvaduray, G., W. Lee and S. Yee, "Fluxless Soldering: A Review," Microelectronic Packaging, 2001, Vol. 1, pp 289-304.

    Selvaduray, G., W. Lee and S. Yee, "Fluxless Soldering: A Review," Microelectronic Packaging, 2001, Vol. 1, pp 289-304.

• 2000

  • Abtew, M. and G. Selvaduray, "Lead-Free Solders in Microelectronics," Materials Science & Engineering Reports, Vol R27, Nos 5-6, June 1, 2000.

    Selvaduray, G, "Recyclability of Microelectronic Systems," Advances in Packaging Development and Research, Edited by J.A. Marcondes, (June 2000) pp 450 - 460.

    Selvaduray, G, "Sintered Architectural Glass Tiles from Recycled Glass," Advances in Packaging Development and Research,, Edited by J.A. Marcondes, (June 2000) pp 461 – 467.

    Lee, W., L.T. Nguyen and G. Selvaduray, "Solder Joint Fatigue Models – Review and Applicability to Chip Scale Packages," Microelectronics Reliability, 40 (2000), pp 231-244.

• 1998

  • Selvaduray, G., "Transforming the Mechanical Engineering Curriculum to meet the Challenges of the 21st Century," Invited paper for the Journal of the Japan Society of Mechanical Engineering, November, 1998.

    Selvaduray, G., "Effect of the Hanshin-Awaji Earthquake on Manufacturing Industries," Proceedings of the Sixth National Conference on Earthquake Engineering, EERI, Oakland, California, May 1998.

    Selvaduray, G., "Earthquake Caused Hazardous Materials Incidents at Educational Facilities", Seismic Design, Retrofit and Performance of Nonstructural Components, Applied Technology Council, Redwood City, California, (January 1998)

• 1997

  • Trigwell, S., R. Hayden, K. Nelson and G. Selvaduray, "Effects of Treatment on the Surface Chemistry of NiTi Shape Memory Alloys", Journal of Surface and Interface Analysis, June, 1997.

    Thomas, S., E. Hasenkamp and G. Selvaduray, "Determination of Oxygen Diffusion in Ionic Solids", The Journal of Materials Education, Vol 19, No. 3, pp 213-215.

    Hilden, J., K. Lewis, A. Meamaripour and G. Selvaduray, "Measurement of Springback Angle in Sheet Bending", The Journal of Materials Education, Vol. 19, No. 3, pp 185-198.

    Chao, J., S. Curotto, C. Anderson and G. Selvaduray, "The Effect of Surface Finish on Tensile Strength", The Journal of Materials Education, Vol. 19, No. 3, pp 199-212.

    Selvaduray, G., W. Lee and S. Yee, "Effect of Surface Treatment on the Wetting Force of Eutectic Pb-Sn Solder on Copper Substrates", Design and Reliability of Solder Joints and Interconnects, R. K. Mahidhara, et al. Ed., TMS, Pennsylvania, (1997), pp 259-266.

    Trigwell, S., and G. Selvaduray, "Effects of Surface Finish on the Corrosion of NiTi Alloy for Biomedical Applications", Proceedings of the Second International Conference on Shape Memory and Superelastic Technologies: Engineering and Biomedical Applications, Pacific Grove, California, (March 2-6, 1997)

• 1996

  • Trigwell, S., G. Selvaduray and A. Singh, "Effects of Intermetallic Compound Formation on the Electrical Performance of Wirebonded Interconnects", Intl. J. of Microcircuits and Electronic Packaging, Vol. 19, No. 1, First Quarter 1996. pp 14-21.

• 1995

  • Selvaduray, G., "Environmental Integration and Technologies", Advanced Manufacturing: Technology and International Competitiveness, UCRL-ID-120595, Feb 1995.

    Selvaduray, G., "Undergraduate Engineering Ceramics Laboratory Development", International Journal of Engineering Education, Vol. 11, No. 4-5, (1995) pp 374-379.

• 1994

  • Selvaduray, G. and A. Singh, "Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison", Intl. J. of Microcircuits and Electronic Packaging, Vol. 17, No. 1, First Quarter 1994. pp 14-21.

    Aggarwal, I. and G. Selvaduray, "Role of CuxSny Intermetallics in the Reliability of Controlled Collapsed Chip Connection (C4)", Proc. 8th International Electronic Materials & Processes Conference, ASM International, San José, California, August 1993. pp 75-82.

• 1993

  • Selvaduray, G . and L. Sheet, "Aluminum Nitride: A Review of Synthesis Methods", Materials Science and Technology, June 1993, Vol. 9, pp 463-473.

• 1992

  • Selvaduray, G ., C. Zhang, et al, "Effect of CO2 on the Processing of Y-Ba-Cu-O Superconductors", Journal of Materials Research, Vol. 7, No. 2, Feb 1992, pp. 283-291.

• 1991

  • Selvaduray, G., "Materials Selection Parameters for Ceramic Substrates: Property-Processing Relationships", Materials Developments in Microelectronic Packaging: Performance and Reliability, P. Singh, Ed., ASM International, (1991) pp 29-35.

    Balachandran, U., D. H. Xu, G. Selvaduray, et al, "Characterization of YBCO Superconductors Sintered in CO2-Containing Atmospheres", Ceramic Transactions, Vol. 18, 1991. pp 341-355.

• 1990

  • Selvaduray, G., D. Richard, D. Quinn, and D. Rowland, "Relationship Between Microstructure and Physical Properties of Al2O3 and SiC Reinforced Aluminum Alloys", Interfaces in Metal Ceramics Composites, R.Y. Lin, et al, Eds., TMS, (1990) pp 271 - 289.

    Selvaduray, G. and L. Martinez, "Thin Alumina Coatings on Borosilicate Glass: Interfacial Interactions During Heat Treatment", Interfaces in Metal Ceramics Composites, R.Y. Lin, et al, Eds., TMS, (1990) pp 137 - 150.

• 1988

  • Selvaduray, G. , M. B. Lange and D. Sullivan, "Chemical Characterization of Ceramic Substrates for Microelectronic Packaging", Proc. Symp. on Adv. Characterization Techniques for Ceramics, Electronics Division of The American Ceramic Society, San Francisco, (Oct. 1988).

• 1987

  • Selvaduray G. and M. B. Lange, "Ceramic Microchip Packages: Materials Selection Parameters", Proc. Ceramic Substrates and Packages, An International Symposium, Electronics Division of The American Ceramic Society, Inc. Denver, (Oct 1987).

    Selvaduray, G., "Die Bond Materials and Bonding Mechanisms in Microelectronic Packaging", Thin Solid Films, 153, (1987).

• 1985

  • Selvaduray, G., "Industrial Uses for Liquid Tin", Tin International, (May 1985).

    Selvaduray, G., "Industrial Earthquake Preparedness in Shizuoka and the Role of the Prefectural Government", Earthquake Spectra, Vol. 1, No. 2, pp 307-318, EERI, Berkeley, Calif. (Feb 1985).

• 1984

  • Selvaduray, G., "Liquid Tin as a Solvent Metal and Reaction Medium", Tin and Its Uses, No. 141, pp. 12-13. (1984).

    Selvaduray, G., "Pyrometallurgical Reprocessing of Carbide Breeder Fuels", Proc. Int. Meeting on Fuel Reprocessing and Waste Management, American Nuclear Society, Wyoming. (Aug 1984).

• 1983

  • Selvaduray, G ., "The Liquid Tin Process: An Experimental Investigation of a Potential Pyrometallurgical Process for Reprocessing Irradiated Carbide Fuels for Fast Breeder Reactors", European Appl. Res. Rept. - Nucl. Sci. Tech., Vol. 4, No. 6, pp. 1451-1514. (1983).

• 1981

  • Ohto, T. and G. Selvaduray , "Effect of Backup Roll Length and Roll Neck Length on Profile for 4-h Mills", Iron and Steel Engineer, Vol. 58, No. 3, pp. 60-65. (Mar 1981).

• 1979

  • Selvaduray, G. , and L. Heising, "Proliferation Resistant Reprocessing Methods", Nuclear Engineering International, Vol. 24, No. 292. (Nov 1979).

• 1978

  • Selvaduray, G., R. N. Anderson and M. Goldstein, "Separation Technologies Reviewed", Nuclear Engineering International, Vol. 23, No. 275, pp. 35-40. (Aug 1978).

    Goldstein, M., G. Selvaduray and R. N. Anderson, "Survey of Reprocessing Technologies", Brookhaven National Laboratory Report No. BNL-23083R.

• 2007

  • Guna Selvaduray, "Moving Beyond Borders," Cabrillo College Engineering Seminar Series, Aptos, California (March 20, 2007)

    Guna Selvaduray, "Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Printed Circuit Board Coatings," Minerva M. Cruz and Guna S. Selvaduray International Conference on Lead-free Materials Surface Finishes, San Jose, California, USA (8-9 May 2007)

    Guna Selvaduray, "Cost-Effective Methods for Reducing Earthquake Vulnerability," Business Continuity Planning Conference VII, San Jose, California (June 6, 2007)

    Guna Selvaduray, "Medical Devices: Engineering’s Contributions to the Quality of Life," Silicon Valley Professionals Lecture Series, Studies in American Languages Program at SJSU. (August 31, 2007)

• 2006

  • Guna Selvaduray, "Mitigation – the Key to Survivability," SJSU Alumni College, San Jose, California. (October 14, 2006)

    Guna Selvaduray, "Medical Devices: Improving the Quality of your Life," SJSU Alumni College, San Jose, California. (October 14, 2006)

    Guna Selvaduray, "When Engineering Generates Life: An Overview of Medical Devices Packaging," International Microelectronics and Packaging Society, Northern California Chapter Meeting, Sunnyvale, California. (November 1, 2006)

    Guna Selvaduray, "Surface Treatment, Surface Characteristics & Biocompatibility of AISI 316L Stainless Steel," Frontiers in Biomedical Devices Conference, ASME, Irvine, CA (June 8-9, 2006)

• 2005

  • G. Selvaduray, "Biomedical Devices - Current Developments and Future Trends", Symposium on Roadmaps for Next General Semiconductor Packaging, Sunnyvale, California. (November 17, 2005) (Invited Keynote)

    G. Selvaduray, "Nonstructural Hazard Mitigation", Symposium on Best Practices in Risk Reduction for Colleges and Universities, University of Washington, Seattle. (January 27-28, 2005)

    G. Selvaduray, "Nonstructural Earthquake Hazard Mitigation", Certified Emergency Manager Lecture Series II, City of San Jose, San Jose, California. (February 24, 2005) (Invited)

    G. Selvaduray, "Pb-Free Solders and their Effectiveness", International Microelectronics and Packaging Society, Northern California Chapter Meeting, Sunnyvale, California. (April 6, 2005) (Invited Luncheon Speaker)

    G. Selvaduray, "Effect of Surface Modifications on Biocompatibility of Implantable Medical Devices", ASM International, Santa Clara Valley Chapter Symposium, San Jose, California (September 17, 2005) (Invited)

    G. Selvaduray, "Surface Modifications of Implantable Medical Devices" San Jose State University Biology Department Seminar Series, San Jose, California. (October 12, 2005) (Invited)

    G. Selvaduray, "Introduction to Biomaterials", Cabrillo College, Aptos, California. (October 24, 2005) (Invited).

    G. Selvaduray, "Partnership Building for Disaster Mitigation: Collaboration among Public, Private and Academic Sectors", International Workshop on Emergency Response and Rescue, Taipei, Taiwan. (October 31-November 1, 2005) (Invited)

    G. Selvaduray, "Effect of Surface Treatment on Surface Characteristics of 316L Stainless Steel", Materials and Processes for Medical Devices Conference, Boston, Massachusetts. (November 14-16, 2005)

• 2004

  • G. Selvaduray, "Biomedical Devices and Biomedical Implants", Symposium on Leading Technologies, College of Engineering, San Jose State University, February 26, 2004. (Invited)

    G. Selvaduray, "Mitigating Natural Hazards", Disaster Resistant California 2004 Conference, Sacramento, California. (May 3, 2004) (Invited Keynote Address).

    G. Selvaduray, "The Collaborative for Disaster Mitigation at San Jose State University", Forum on Emergency Management, Ministry of Land, Infrastructure and Transport (MLIT), Sapporo, Japan. (June 16, 2004) (Invited)

    G. Selvaduray, "Mitigating Disasters", US-Japan Disaster Reduction Forum, Crisis and Environment Management Policy Institute, Tokyo, Japan. (June 17, 2004) (Invited)

    G. Selvaduray, "Developing Collaborative Approaches for Disaster Mitigation", Shizuoka NPO International Forum, Hamamatsu, Japan. (June 19-20, 2004) (Invited)

    G. Selvaduray, "Sn-Whiskers: Driving Force and Growth Mechanisms", GEM Electronics (Shanghai) Co., Ltd., Shanghai, China. (July 29, 2004) (Invited)

    G. Selvaduray, "Pb-Free Solders in Microelectronic Assembly", GEM Electronics (Shanghai) Co., Ltd., Shanghai, China. (July 28, 2004) (Invited)

• 2003

  • G. Selvaduray, "Effect of Surface Treatment on Performance of Biomedical Implants", Edwards Lifesciences LLC, Irvine, California, August 12, 2003. (Invited).

    G. Selvaduray, "Microdevice Packaging for Biomedical Applications", Symposium on Package Reliability Issues and Challenges, Microelectronic Packaging and Test Engineering Council, Sunnyvale, California. August 28, 2003. (Invited)

    G. Selvaduray, "Protecting Laboratory Equipment by Implementing Nonstructural Hazard Mitigation," Seismic Design, Retrofit and Performance of Nonstructural Components in Critical Facilities, ATC-29-2, Applied Technology Council, Redwood City, California, October 23, 2003.

    G. Selvaduray, "Natural Disaster Reduction", Forum on Sustainable Development, Asian Civil Engineering Coordinating Council, Taipei, Taiwan, December 4, 2003. (Invited)